TTM Technologies, Inc. (NASDAQ: TTMI) has disclosed plans to invest an additional $400 million to expand manufacturing capacity across four facilities in China and one facility in Penang, Malaysia. The announcement, made on October 12, 2026, details a strategic initiative to support the growing demand for artificial intelligence infrastructure. This investment is described as incremental to the company’s previously disclosed commitment to invest $1.2 billion during the 2025 to 2029 period.
The expansion is specifically designed to scale TTM’s advanced N+M asymmetrical interconnect manufacturing technology. The company intends to utilize a “rapid-ramp” brownfield approach, which involves optimizing existing operational space and integrating new equipment to bring AI-specific printed circuit board (PCB) production capacity online efficiently. This strategy is intended to shorten the time between investment and revenue generation for customers.
TTM Technologies is a global manufacturer of technology products, including mission systems, radio frequency components, and technologically advanced interconnect products. The company stated that the expansion is supported by ongoing discussions with long-standing customer partners indicating expected demand increases. TTM anticipates providing additional commentary for investors during its Third Quarter 2026 Earnings Conference call, with the specific date and time to be announced in coming weeks.